Setoriginal Packaging

The Beatles Stereo Box Set Packaging – Please Please Me / The White Album

Packaging $30 This book is in New – Excellent condition

Fuel Cell Electronics Packaging $159 Fuel Cell Electronics Packaging

Materials for Advanced Packaging $129 Materials for Advanced Packaging

RF and Microwave Microelectronics Packaging $129 RF and Microwave Microelectronics Packaging

Plastic Packaging $369 Plastics are the most important class of packaging materials. This successful handbook, now in its second edition, covers all important aspects of plastic packaging and the interdisciplinary knowledge needed by food chemists, pharmaceutical chemists, food technologists, materials scientists, process engineers, and product developers alike. This is an indispensable resource in the search for the optimal plastic packaging. Materials characteristics, additives and their effects, mass transport phenomena, quality assurance, and recent regulatory requirements from FDA and European Commission are covered in detail with ample data.

Packaging Sustainability $49.95 How to take the lead with sustainable packaging design solutions With initiatives like the Wal-Mart Scorecard in the U.S. and the E.U.’s Packaging Directive, delivering sustainable packaging is now an integral part of today’s global competitive market. Written by experts from a wide variety of fields, here is a comprehensive, single source of actionable information that enables everyone involved in the design and development process to make smart, informed decisions, opening new possibilities for creating truly innovative solutions. Wendy Jedlicka, CPP (Roseville, MN) is President of Jedlicka Design Ltd. and a member of the faculty at Minneapolis College of Art and Design’s groundbreaking Sustainable Design Certificate Program. A Certified Packaging Professional, she serves as Upper Midwest Chapter Chair (o2umw.org), as well as U.S. co-coordinator for the o2 Global Green Design Network (o2.org), and contributes frequently to Packaging Design magazine’s “Sustainability Update” feature column.

Mems Packaging $118 MEMS Packaging discusses the prevalent practices and enabling techniques in assembly, packaging and testing of microelectromechanical systems (MEMS). The entire spectrum of assembly, packaging and testing of MEMS and microsystems, from essential enabling technologies to applications in key industries of life sciences, telecommunications and aerospace engineering is covered. Other topics included are bonding and sealing of microcomponents, process flow of MEMS and microsystems packaging, automated microassembly, and testing and design for testing. The Institution of Engineering and Technology is one of the world’s leading professional societies for the engineering and technology community. The IET publishes more than 100 new titles every year; a rich mix of books, journals and magazines with a back catalogue of more than 350 books in 18 different subject areas including: -Power & Energy -Renewable Energy -Radar, Sonar & Navigation -Electromagnetics -Electrical Measurement -History of Technology -Technology Management About the Author Professor Tai-Ran Hsu received his Ph.D. from McGill University in Canada in mechanical engineering, and worked for power plant equipment and nuclear industries prior to joining the academe. He is currently a Professor and Director of Microsystems Design and Packaging Laboratory at San Jose State University, and has published 120 technical papers and five books in FE, CAD and MEMS design, manufacture and packaging.

RFID in Packaging $460 According to Pira International research, use of radio frequency identification devices (RFID) in packaging is set to grow tenfold over the next five years. The market, a modest Euro15m in 2002, is expected to be worth Euro163m in 2007. This expansion is likely to be driven by the rapidly plunging prices of RF tags. Industry sources expect that by 2010, price per tag will have fallen to less than Euro0.01. At this kind of price, RFID has the potential to become the successor to barcodes. Pira’s study, RFID in Packaging will tell you everything you need to know about this exciting technology and the opportunities it is creating. RFID in Packaging is the first-ever technology report on RFID aimed specifically at the consumer packaging and brand protection industry. It is designed to provide brand owners, packaging converters, equipment and technology suppliers with a complete user’s guide RFID. The study assesses potential applications, market sizes, drawbacks, pitfalls, costs, standards and contains inside information on the results of all the latest RFID trials conducted by brand owners.

Active Packaging $460 This report by Pira International looks at the latest developments, products and applications for the fast emerging area of active packaging. Long heralded as a solution to problems such as extending shelf life and improving food safety and quality, the technology has been slow to hit the mainstream outside of Japan as legislative barriers and cost issues stymied progress. Now, following the completion of the EU-funded Actipak project in 2002 and the increasing movement away from loose sachet products, the path has been cleared for active packaging to expand in other markets. Research recently carried out by Pira suggests that annual growth rates could be as high as 20%. A similar story is unfolding in the US as food brand owners look to improve supply chain efficiencies through active packaging technologies – especially PET packaged beers. This report concentrates on the technologies likely to succeed over this initial period of rapid growth in Europe and US. Each technology is examined by our team of technical experts taking you through existing products, development products, breakthroughs/ findings at basic research level, consumer reactions, existing and future applications and costs. With 20% growth levels forecast, this technology study is essential reading for any business which deals with food products.

Semiconductor Packaging $149.95 In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing–package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability. By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.